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        上海SMT貼片加工廠
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        偉利仕(上海)電子有限公司

        偉利仕(上海)電子有限公司

        公司地址:上海市閔行區閔北路288號

        總      機:021-64064840 

        業務電話:13391139172

                         13818505445

        傳  真:021-64065245

        網       址:   www.fjwlg.com

        業務郵箱:sales@wellex.com.cn


         BGA設備&能力  BGA Equipment & Capability 


        1、BGA工藝制程控制: BGA烘烤、錫膏回溫、網板印刷、爐溫

        Process control of BGA assembly: Bulk BGA baking, warming-up solder paste, stencil printing, oven temperature.


        2、BGA 最小間距:0.3MM

        Minimum space between components:0.3MM



        SMT 設備能力  SMT Capability


        1、生產線貼裝產能:9500萬點/月

        SMT line productivity: 95 million points per month


        2、大PCB板尺寸:L = 510MM, W = 460MM

        Maximum size of PCB: L = 510MM, W = 460MM


        3、最小PCB板尺寸:L = 50MM, W = 30MM

        Minimum size of PCB: L = 50MM, W = 30MM


        4、貼片PCB板厚度:0.4MM - 4MM (1-12層)

        Thickness of PCB: 0.4MM - 4MM (1-12 layers)


        5、貼片最小尺寸:0201 (0.6*0.3MM)

        Minimum component size for SMT: 0201 (0.6*0.3MM)


        6、貼片大異型:33.5*33.5MM

        Maximum component size for SMT: 33.5*33.5MM


        7、芯片最小間距:0.2MM

        Minimum space between components:0.2MM


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